In response to Korean media reports, South Korea’s Samsung recently hired Lin Juncheng, the former deputy director of R&D who had worked for TSMC for 18 years, as the vice president of the advanced packaging business team of the company’s semiconductor (DS) department, responsible for the development of advanced packaging technology. Analyst Lu Xingzhi posted on his personal Facebook fan page that Taiwan should also follow the example of the United States and require relevant personnel to work in Chinese wafer manufacturing plants to require a license to prevent the malicious poaching of TSMC’s rival Samsung.
According to Korean media reports, Lin Juncheng, who was poached from Samsung, became a semiconductor packaging expert. He worked for TSMC from 1999 to 2017 and coordinated the application for more than 450 US patents. Lin Juncheng also contributed to laying the foundation for TSMC’s 3D packaging technology. Before joining TSMC, Lin Juncheng worked for Micron Technology, an American memory company. After leaving TSMC, he served as the CEO of Skytech, a Taiwanese semiconductor equipment company, and accumulated experience in packaging equipment production.
In this regard, Lu Xingzhi said that in order to prevent mainland China from setting up branches in Taiwan to maliciously poach Taiwanese semiconductor elites, and the US government requires American/dual nationality semiconductor manufacturing and equipment support personnel to work in mainland China’s wafer manufacturing plants (support, development , manufacturing) requires a license (effective October 12, 2022). Should we consider using the same strict standard amendments to prevent the malicious poaching of T Company’s arch-enemy Samsung in the next 10-20 years? Mr. Lin’s case should be different, because he had already left T Company in 2017 to join Micron and Texhong Technology. What worries many Mr. Liang.